Shielding can for a printed circuit board

专利名称：Shielding can for a printed circuit board发明人：Koleda, Eugen申请号：EP00305142.2申请日：20000616公开号：EP10617A3公开日：20010912

专利附图：

摘要：A shielding can for a printed circuit board comprise a frame with side walls and alid with means to increase flexibility of the lid. The flexibility means are slits on the sidesof the lid. These slits enable a flexible contraction, when soldering the shielding can ontothe printed circuit board. The invention also includes a method for mounting the

shielding can onto printed circuit boards. The shielding can is placed onto the printedcircuit board and heated slowly to melt the solder paste to solder the shielding can tothe printed circuit board. The heating phase is followed by a fast cooling phase, and theflexible means (the slits on the shielding can) reduces the internal stress, which occurswhen the shielding can is exposed to different temperatures at the same time, withoutany permanent deformations.

申请人：NOKIA MOBILE PHONES LTD.

地址：Keilalahdentie 4 02150 Espoo FI

国籍：FI

代理机构：Jones, Kendra Louise

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