Methods and apparatuses for making and using plana

专利名称：Methods and apparatuses for making and

using planarizing pads for mechanical andchemical-mechanical planarization ofmicroelectronic substrates

发明人：Guy T. Blalock申请号：US10142675申请日：20020510

公开号：US20020124958A1公开日：20020912

专利附图：

摘要：Methods and apparatuses for planarizing a microelectronic substrate. In one

embodiment, a planarizing pad for mechanical or chemical-mechanical planarizationincludes a base section and a plurality of embedded sections. The base section has aplanarizing surface, and the base section is composed of a first material. The embeddedsections are arranged in a desired pattern of voids, and each embedded section has a topsurface below the planarizing surface to define a plurality of voids in the base section.The embedded sections are composed of a second material that is selectively removablefrom the first material. A planarizing pad in accordance with an embodiment of theinvention can be made by constructing the embedded sections in the base section andthen removing a portion of the embedded sections from the base section. By removingonly a portion of the embedded sections, this procedure creates the plurality of voids inthe base section and leaves the remaining portions of the embedded sections. After thepad is used to planarize one or more substrate assemblies and the voids are filled withwaste matter or otherwise altered, an etchant can be deposited on the pad tosubsequently remove an incremental depth of the embedded sections faster than thebase section to reform the voids over the embedded sections.

申请人：BLALOCK GUY T.

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