NUF2230XV6
2 Line EMI Filter with ESDProtection
This device is a 2 line EMI filter array for wireless applications.Greater than −30 dB attenuation is obtained at frequencies from800 MHz to 900 MHz. It also offers ESD protection−clampingtransients from static discharges. ESD protection is provided across allcapacitors.
Features
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Pin 6D(2)Pin 5GNDPin 4O(2)•EMI Filtering and ESD Protection•Integration of 10 Discrete Components•Compliance with IEC61000−4−2 (Level 4)•SOT−563 Package
•Moisture Sensitivity Level 1•ESD Ratings:Machine Model = C•
> 8.0 kV (Contact)
Human Body Model = 3BThese are Pb−Free Devices
Pin 1D(1)Pin 2GNDPin 3O(1)Benefits
•Reduces EMI/RFI Emissions on a Data Line
•Integrated Solution Offers Cost and Space Savings in a•••••••
MARKINGDIAGRAM61SOT−563CASE 463A123 M GGSOT−563 Package
Reduces Parasitic Inductances Which Offer a More “Ideal” Low PassFilter Response
Integrated Solution Improves System ReliabilityEMI Filtering and ESD Protection for Data LinesWireless Phones
PDAs and Handheld ProductsNotebook ComputersLCD Displays
Applications
23= Specific Device CodeM= Month CodeG= Pb−Free Package(Note: Microdot may be in either location)ORDERING INFORMATION
DeviceNUF2230XV6T1
PackageSOT−563
Shipping†4000/Tape & Reel4000/Tape & Reel
NUF2230XV6T1GSOT−563
†For information on tape and reel specifications,including part orientation and tape sizes, pleaserefer to our Tape and Reel Packaging SpecificationBrochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 20051
July, 2005 − Rev.3
Publication Order Number:
NUF2230XV6/D
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NUF2230XV6
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Parameter
ESD Discharge IEC61000−4−2
Air DischargeContact Discharge
Steady−State Power per ResistorSteady−State Power per PackageOperating Temperature RangeStorage Temperature Range
Maximum Lead Temperature for Soldering Purposes (1.8 in from case for 10 seconds)
SymbolVPP
Value158.0
mWmW
−40 to 85−55 to 150
260
°C°C°CUnitkV
PRPTTOPTSTGTL
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limitvalues (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,damage may occur and reliability may be affected.
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)
Parameter
Maximum Reverse Working VoltageBreakdown VoltageLeakage CurrentResistance
Capacitance (Notes 1 and 2)Cut−Off Frequency (Note 3)
SymbolVRWMVBRIRRACdf3dB
IR = 1.0 mAVRWM = 3.0 VIR = 20 mAVR = 2.5 V, f = 1.0 MHzAbove this frequency,
appreciable attenuation occurs
90
10016125
6.0
7.0
1.0110
Test Conditions
Min
Typ
Max5.0
UnitVVmAWpFMHz
1.Measured at 25°C, VR = 2.5 V, f = 1.0 MHz.
2.Total line capacitance is 2 times the Diode Capacitance (Cd).3.50 W source and 50 W load termination.
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2
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NUF2230XV6
0−5−10S21 (dB)−15−20−25−30−351.E+06
1.E+07
1.E+08FREQUENCY (Hz)
1.E+09
1.E+10
NORMALIZED CAPACITANCE2
1.5
1
0.5
00
1
2
3
4
5
REVERSE VOLTAGE (V)
Figure 1. Insertion Loss Characteristic(50 W Source and 50 W Lead Termination)
Figure 2. Typical Capacitance vs.
Reverse Biased Voltage
(Normalized Capacitance, Cd @ 2.5 V)
110108106RESISTANCE (W)1041021009896949290−40
−20
02040TEMPERATURE (°C)
60
80
Figure 3. Typical Resistance over Temperature
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3
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NUF2230XV6
PACKAGE DIMENSIONS
SOT−563, 6 LEADCASE 463A−01
ISSUE F
NOTES:
1.DIMENSIONING AND TOLERANCING PER ANSIY14.5M, 1982.
2.CONTROLLING DIMENSION: MILLIMETERS3.MAXIMUM LEAD THICKNESS INCLUDES LEADFINISH THICKNESS. MINIMUM LEAD THICKNESSIS THE MINIMUM THICKNESS OF BASE MATERIAL.
MILLIMETERSMINNOMMAX0.500.550.600.170.220.270.080.120.181.501.601.701.101.201.30
0.5 BSC0.100.200.301.501.601.70
INCHES
NOMMAX0.0210.0230.0090.0110.0050.0070.0620.0660.0470.0510.02 BSC0.0040.0080.0120.0590.0620.066MIN0.0200.0070.0030.0590.043
D−X−654AL123E−Y−b6 5 PL0.08 (0.003)HEeCMXYDIMAbCDEeLHESOLDERING FOOTPRINT*
0.30.01180.450.01771.350.05311.00.03940.50.50.01970.0197SCALE 20:1
mmǓǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering andMounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further noticeto any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liabilityarising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. Alloperating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rightsnor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applicationsintended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. ShouldBuyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or deathassociated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an EqualOpportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:N. American Technical Support: 800−282−9855 Toll FreeLiterature Distribution Center for ON SemiconductorUSA/CanadaP.O. Box 61312, Phoenix, Arizona 85082−1312 USAPhone: 480−829−7710 or 800−344−3860 Toll Free USA/CanadaJapan: ON Semiconductor, Japan Customer Focus Center2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051Fax: 480−829−7709 or 800−344−3867 Toll Free USA/CanadaPhone: 81−3−5773−3850Email: orderlit@onsemi.comON Semiconductor Website: http://onsemi.comOrder Literature: http://www.onsemi.com/litorderFor additional information, please contact yourlocal Sales Representative.http://onsemi.com4NUF2230XV6/D
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