专利名称：Apparatus for direct plating on resistive
liners
发明人：Philippe M. Vereecken,Panayotis
Andricacos,Hariklia Deligianni,Keith T.Kwietniak,Caliopi Andricacos
申请号：US11050899申请日：20050127
公开号：US20060163055A1公开日：20060727
专利附图：
摘要：An apparatus for direct electroplating of a conductive material, such as copper,
on resistive liners or substrates is provided. The apparatus includes an integrated in-situmeasuring system to follow the actual progress of the front of the conductive materialduring plating. Feed-back of this information to a power supply allows for more precisecontrol of the effective current density during plating.
申请人：Philippe M. Vereecken,Panayotis Andricacos,Hariklia Deligianni,Keith T.Kwietniak,Caliopi Andricacos
地址：Leuven BE,Chicago IL US,Tenafly NY US,Highland Falls NY US,Chicago IL US
国籍：BE,US,US,US,US
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