Packaging structure

专利名称：Packaging structure

发明人：Jun-Yong Wang,Geng-Shin Shen申请号：US13308828申请日：20111201公开号：US08736060B2公开日：20140527

专利附图：

摘要：This invention relates to a packaging structure and method for manufacturingthe packaging structure. The packaging structure comprises a substrate film, a pluralityof chips, a compound resin layer and a support layer. The substrate film is formed withcircuits having a plurality of terminals exposed from a solder mask. The chips, each of

which has a plurality of pads, under bump metals (UBMs) formed on the pads, andcomposite bumps disposed onto the UBMs, are bonded onto the substrate film to formthe first tape. The second tape comprises the support layer and the compound resinlayer formed on the support layer. The first tape and the second tape are both in reel-form and are expanded towards a pair of rollers to be heated and pressurized forencapsulating the chips.

申请人：Jun-Yong Wang,Geng-Shin Shen

地址：Hsinchu TW,Hsinchu TW

国籍：TW,TW

代理机构：Muncy, Geissler, Olds & Lowe, P.C.

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