专利名称:Semiconductor device having a trench gate
and method of fabricating the same
发明人:Shian-Jyh Lin,Chien-Li Cheng,Chung-Yuan
Lee,Jeng-Ping Lin,Pei-Ing Lee
申请号:US11521639申请日:20060914
公开号:US20070190712A1公开日:20070816
专利附图:
摘要:A method of fabricating a semiconductor device having a trench gate is
provided. First, a semiconductor substrate having a trench etch mask thereon is provided.
The semiconductor substrate is etched to form a trench having a sidewall and a bottomusing the trench etch mask as a shield. Impurities are doped into the semiconductorsubstrate through the trench to form a doped region. The semiconductor substrateunderlying the trench is etched to form an extended portion. A gate insulating layer isformed on the trench and the extended portion. A trench gate is formed in the trenchand the extended portion.
申请人:Shian-Jyh Lin,Chien-Li Cheng,Chung-Yuan Lee,Jeng-Ping Lin,Pei-Ing Lee
地址:Taipei County TW,Hsinchu City TW,Taoyuan City TW,Taoyuan CountyTW,Changhua County TW
国籍:TW,TW,TW,TW,TW
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