Selective plating process for the electrolytic coa

专利名称：Selective plating process for the electrolytic

coating of circuit boards without anelectroless metal coating

发明人：Abraham M. Holtzman,Joseph Relis申请号：US06/931176申请日：19861114公开号：US04790912A公开日：19881213

摘要：A process is disclosed for selectively electrometallizing a non- conductivesubstrate such as the non-conductive surfaces of a circuit board and to directly effectthrough hole plating and/or form circuits of the boards without employing an electrolessmetal coating.< P>< P>A photoresist is employed in the process which is exposed,developed and neutralized prior to electrometallizing the substrate. Selectivity isobtained by neutralization.

Metals are deposited on a non-conductive substrate in the process by using thereductive capacity of hydrogen in the presence of a metal catalyst of the substrate. Themetal catalyst is combined with hydrogen that is generated electrolytically from a proticbath. The metal catalyst combined with hydrogen is contacted with a metal salt. Themetal salt may be combined with the protic bath so that the hydrogen that is generatedelectrolytically combines with the metal catalyst and the metal salt is converted to ametal coating on the substrate.

申请人：TECHNO-INSTRUMENTS INVESTMENTS LTD.

代理机构：Scully, Scott, Murphy & Presser

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